Heat Sinks

Heat Sinks are the primary form of thermal management solutions used today. Heat Sinks are employed mainly to increase the surface area available for heat transfer from high-power semiconductor devices (e.g., RF Power Transistors, RF Amplifiers, Power Rectifiers, Power Inverter Modules, IGBTs, Thyristor Modules), systematically reducing the device’s external case temperature, as well as its internal junction temperature. This allows the high-powered semiconductor devices to approach their absolute highest levels of performance, while ensuring maximum reliability.Heat Sinks are most always needed to keep high-powered semiconductor devices within their “safe operating area”.

Richardson RFPD has partnered with the leading suppliers of thermal management solutions to provide state-of-the-art Heat Sinks.