219-263B-TR


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Product image for reference only. For precise specifications, refer to datasheet.

Manufacturer: Wakefield Thermal
Mfg #: 219-263B-TR
Richardson RFPD #: 219-263B-TR
Description: Board Level Heat Sink
Min/Mult: 1,250/1
Datasheet 219-263B-TR Data Sheet
EDA/CAD Models

The 219 Series heat sinks unique design (Patent Pending) combines the technology of automatically assembling the tin plated solderable wires/rods with that of extruded aluminum anodized heat sink body to configure these SMT heat sinks. Rods/wires named "Rollers" are mated mechanically to the heat sink body by forging to reduce the interface thermal resistance between the drains & heat dissipation body.

Features & Benefits
  • Increased thermal performance up to 30% over bright copper heat sinks from improved radiation of the black finish
  • Increased surface areas by 3 times therefore thermal performance up to 300% over the aluminum stamped heat sinks on markets
  • Light weight aluminum construction allows faster pick and place assembly reducing the manufacturing cycle time
  • Radius mounted “Rollers” are designed for maximizing heat transfer from component and to avoid “bottle neck” heat transfer like the Aluminum stamped heat sinks

Key Attributes Value Search Similar
Package Cooled TO-263
Thermal Resistance (°C/W) 8
Height (mm) 12.19
Height (in) 0.48
Mounting

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Unit Price:
1:  $2.1200


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