258

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258 Wakefield Thermal
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Product image for reference only. For precise specifications, refer to datasheet.

Manufacturer: Wakefield Thermal
Mfg #: 258
Richardson RFPD #: 258
Description: Board Level Heat Sink
Min/Mult: 100/1
Datasheet 258 Data Sheet
EDA/CAD Models

The thermal resistance from diode leads to chassis or heat sink is 12°C/watt, when unit is mounted with TYPE 120 Joint Compound. If a 10°C/watt chassis or sink to ambient impedance is available, the thermal resistance from the diode leads to ambient is reduced from about 150°C/watt to 22°C/watt.

Key Attributes Value Search Similar
Package Cooled Fused Glass Diode (axial)
Thermal Resistance (°C/W) 12
Height (mm) 12.7
Height (in) 0.5
Mounting Conventional

Datasheets

  board_level_heat_sinks_22-38 Datasheet

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Unit Price:
100:  $20.5300
300:  Get Quote


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