25SMT-6101-01

The Supersoft Series of GORE^® SMT EMI Gaskets and Grounding Pads are standard components that enable designers to create EMI shields in non-linear 2-D or 3-D shapes, reduce device thickness where EMI cans are used, and create grounding points as needed in a very small footprint on the circuit board. These components are highly conductive on contact, easily compressed with minimal force, and resilient after compression. These features ensure consistent electrical performance and makes Gore’s Supersoft Series an excellent choice for EMI shielding or grounding for systems such as LCDs, flexible circuits, antennas, and cameras and devices such as smart phones, tablets, and laptops. The highly compressible construction, requiring low closure forces, makes it suitable for devices with plastic housings and also provides consistent contact in housings that have surface variations such as aluminum as-cast enclosures.