Single Diode Configuration: MACOM's Broad line of packaged PIN diodes encompasses a comprehensive range of electrical characteristics and package outlines. This diverse union of semiconductor technology and chip packaging gives considerable flexibility to the circuit designer. The fast switching series of packaged PIN diodes utilize a thin I-region and silicon oxide or glass passivated chips which provide for low leakage currents and low insertion loss. Using in process control monitors to regulate wafer fabrication parameters these devices achieve consistent performance in control circuit applications. The high voltage product line of packaged PIN diodes employs MACOM's unique CERMACHIP® passivation process which provides for a hard glass encapsulation that hermetically seals the active area of the chip. These packaged CERMACHIP® PIN diodes are ideally suited for use in high power applications where high RF voltages are present. The diode chips are bonded into sealed ceramic packages that are designed for the most stringent electrical and environmental conditions. A wide choice of packages are available which can be mounted into a variety of microwave and RF circuit media. The Packaged PIN Diodes series are designed to have a high inherent reliability and may be ordered screened to meet many MIL-STD reliability levels
