SEMIX453GD176HDC

SEMiX® offers users a high degree of flexibility in system configuration. Inverters, for instance, can be constructed either with compact sixpacks (SEMiX® 13/33c) or with thermally decoupled half bridges in the same family of housings. This can result in a better thermal spreading effect that can reduce the external thermal resistance by up to 20 %, thus making it possible to increase the current by up to 15 % or reduce the chip temperature by 15...20 K. If these advantages are not made use of, less complex heat sink designs than those in sixpacks are possible.