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Extruded Heat Sink

An extruded heat sink enhances heat transfer from high-power semiconductor devices, lowering external case and internal junction temperatures for optimal performance and reliability. It is essential for various devices, including RF power transistors and IGBTs, and is crucial in power conversion applications. These heat sinks are utilized across numerous industries such as renewable energy, automotive, and telecommunications. When choosing a heat sink, consider dimensions, thermal resistance, and extrusion shape for the best price-performance ratio. Richardson RFPD offers the support to help you address any thermal management challenges you face to ensure the highest performance of your power conversion system and the longest life of the components in your design.



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Image Item Mfg Part # Mfg Description Datasheet Availability Min/Mult Price (US Stock) Quantity ECAD Model Width
(mm)
Height
(mm)
Width (in)
(in)
Height (in)
(in)
Length (in)
(in)
Thermal Resistance
(°C/W)
Extrusion Shapes
392-180AB

392-180AB Wakefield Thermal Extruded Heat Sink Data Sheet Link Request Quote for Lead Time 25/1
25:   $101.9400
50:   Get Quote

125 135.8 4.921 5.346 0.43 Flatback Double Channel
510-12M

510-12M Wakefield Thermal Extruded Heat Sink Data Sheet Link Request Quote for Lead Time 25/1
25:   $98.9900
50:   Get Quote

187.452 78.9 7.38 3.106 0.24 12 in Long
511-9M

511-9M Wakefield Thermal Extruded Heat Sink Data Sheet Link Request Quote for Lead Time 25/1
25:   $63.2400
50:   Get Quote

132.33 59.7 5.21 2.35 0.56 9 in Long