Extruded Heat Sink

An extruded heat sink enhances heat transfer from high-power semiconductor devices, lowering external case and internal junction temperatures for optimal performance and reliability. It is essential for various devices, including RF power transistors and IGBTs, and is crucial in power conversion applications. These heat sinks are utilized across numerous industries such as renewable energy, automotive, and telecommunications. When choosing a heat sink, consider dimensions, thermal resistance, and extrusion shape for the best price-performance ratio. Richardson RFPD offers the support to help you address any thermal management challenges you face to ensure the highest performance of your power conversion system and the longest life of the components in your design.

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Mfg

Wakefield Thermal (2)

Width (mm)

182.88 (1)
187.325 (1)

Select Min 182.88 187.325
Select Max 182.88 187.325

Height (mm)

61.214 (1)
79.502 (1)

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Select Max 61.214 79.502

Width (in)

7.2 (1)
7.375 (1)

Height (in)

2.41 (1)
3.13 (1)

Length (in)

72 (1)
77 (1)

Thermal Resistance (°C/W)

0.9 (1)
1.2 (1)

Select Min 0.9 1.2
Select Max 0.9 1.2

Extrusion Shapes

Flatback HIGH FIN (2)

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	Image	Item	Mfg Part #	Mfg	Description	Datasheet	Availability	Min/Mult	Price (US Stock)	Quantity		ECAD Model	Width (mm)	Height (mm)	Width (in) (in)	Height (in) (in)	Length (in) (in)	Thermal Resistance (°C/W)	Extrusion Shapes
		1051663T577-00	1051663T577-00	Wakefield Thermal	Extruded Heat Sink		51	1	Call RFPD		Quote		187.325	79.502	7.375	3.13	77	1.2	Flatback HIGH FIN
		6438263T572-00	6438263T572-00	Wakefield Thermal	Extruded Heat Sink		21	1	Call RFPD		Quote		182.88	61.214	7.2	2.41	72	0.9	Flatback HIGH FIN