A0-VP122PA300M7-L757F70T

VINco E3, the new low-profile package for motion control, solar and UPS applications

Featuring the SLC (SoLid Cover) technology in the industry-standard low-profile package, Vincotech’s new VINco E3 package enables engineers to design mid-power inverters with higher output current, higher power density and improved reliability for industrial drives, solar power, UPS and other applications.

• Low-loss, Mitsubishi gen 7 or Trench IGBT4 chip technology
• Extended module life-time
• Industry-standard, low-profile package
• Built-in NTC
• Scalable product platform