A0-VS126PA100M7-L997F70

Vincotech has now extended the new industry-standard low-profile package for mid-power inverters by a sixpack configuration. Engineered mainly for industrial drives, solar power, and UPS applications, the VINcoPACK E3 raises the performance bar with its superior efficiency and reliability.

Following the VINcoDUAL E3, the new 1200 V sixpack module VINcoPACK E3 features SLC (SoLid Cover) technology, which combines an insulated metal baseplate and direct potting resin to achieve both high thermal and high power cycling capability. This module is also equipped with the latest low-loss IGBT M7 chips and achieves high power density.

• Extended module lifetime based on the new SLC- and IMB Technology
• Increased power density featuring the new IGBT M7 chip technology
• Multiple chip sourcing ensuring the highest supply chain safety
• Cost competitive w/o expensive base plate component

• Industry-standard, low-profile package
• Built-in NTC
• Scalable product platform

• Industrial drives
• Solar
• UPS