GA10K3CG582

TE Connectivity offers a comprehensive range of Gold terminated leadless NTC chip thermistors for today’s hybrid microelectronics needs. With metallization on top and bottom surfaces, attachment to hybrid, IC or PC circuits is accomplished using industry standard die attach and wire bonding techniques. Chips may be soldered or bonded with conductive epoxy to board termination points where space is at a premium. Typical square-chip sizes range from 0.35 mm to 1.2 mm depending on the preferred ceramic system and nominal ohmic resistance. MTTF reliability information is provided for the complete range of gold chip products for customer selection and design-in. Gold terminated NTC thermistors are supplied in “waffle” packs for protection and ease of customer handling.

• Gold electrodes suitable for wire bonding
• Mount directly to substrate for fast timeresponse
• Temperature range -40 C to +125 C
• High stability performance with additional aging steps
• Delivers advanced electro-ceramic materials with fine grained microstructure
• Packed in waffle trays

• WDM (Wavelength Division Multiplexing) for advanced frequency control in communications systems and wireless applications
• Thermopile sensors for thermal radiation recognition and infrared sensing
• Thermal protection of sensitive circuits
• Hybrid circuit temperature compensation
• Localized temperature sensing
• Laser diode modules