MADP-000235-10720T

The MADP-000235-10720T is a surface mount PIN diode in a non-magnetic Metal Electrode Leadless Faced (MELF) package. The MADP-000235-10720T is manufactured using M/A-COM Technology Solutions time proven HIPAX technology. The result is a low inductance ceramic package with no ribbons or wires. The package utilizes a unique non-magnetic plating process that provides for a hermetically sealed component that has extremely low electromagnetic permeability. Incorporated in the package is a glass passivated CERMA chip that is full face bonded on the cathode and anode which maximizes the surface contact area to minimize the electrical and thermal resistances. The chip and package have been comprehensively characterized both electrically and mechanically to ensure repeatable and predictable performance.