MADP-017015-13140P


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Manufacturer: MACOM Technology Solutions
Mfg #: MADP-017015-13140P
Richardson RFPD #: MADP-0170151314
Description: RF PIN Diode
Min/Mult: 3,000/1
Datasheet MADP-0170151314 Data Sheet
EDA/CAD Models

This device is a silicon, glass PIN diode surmount chip fabricated with MACOM's patented HMIC™ process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical topology provides for exceptional heat transfer. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly.|Applications:|These packageless devices are suitable for usage in moderate incident power, ? 50dBm/C.W. or where the peak power is ? 75dBm, pulse width is ? 1?S, and duty cycle is ? 0.01%. Their low parasitic inductance, 0.4 nH, and excellent RC constant, make these devices a superior choice for higher frequency switch elements when compared to their plastic package counterparts.

Key Attributes Value Search Similar
Diode Configuration Single Diode
Minimum Frequency (MHz) 1
Maximum Frequency (MHz) 1800
Vr (Reverse Voltage) (V) -115
Total Capacitance (pF) 0.32
Rs (Series Resistance) (Ω) 0.72
Package Type ODS 1314
Mounting Style

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