MASW-003103-13640G


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Product image for reference only. For precise specifications, refer to datasheet.

Manufacturer: MACOM Technology Solutions
Mfg #: MASW-003103-13640G
Richardson RFPD #: MASW-003103-136
Description: RF and Microwave Switch
Min/Mult: 50/1
Datasheet MASW-003103-136 Data Sheet
EDA/CAD Models

HMIC™ Silicon PIN Diode SP3T Switch. The MASW-003103-1364 is a Surmount™ broadband monolithic SP3T switch using series and shunt connected silicon PIN diodes. This part is designed for use as a moderate signal, high performance switch in applications up to 20 GHz. The Surface Mount chipscale configuration is optimized for broadband performance with minimal associated parasitics usually associated with hybrid MIC designs incorporating beam lead and PIN diodes that require chip and wire assembly. The MASW-003103-1364 is fabricated using MACOM Tech's patented HMIC™ (Heterolithic Microwave Integrated Circuit) process, US Patent 5,268,310. This process allows the incorporation of silicon pedestals that form series and shunt diodes or vias by imbedding them in low loss, low dispersion glass. By using small spacing between elements, this combination of silicon and glass gives HMIC devices low loss and high isolation performance through low millimeter frequencies. Selective backside metalization is applied producing a Surface Mount device. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode airbridge during handling and assembly.


Key Attributes Value Search Similar
Technology Diode Based
Minimum Frequency (MHz) 50
Maximum Frequency (MHz) 20000
Configuration (SPST/SPDT ...) SP3T
Matching (Non-/Reflective) Reflective
Insertion Loss (dB) 0.5
Isolation (dB) 54
P1dB (dBm) 36
Input IP3 (dBm)
Max. Input Power (dBm) 33
Switching Time (ns) 20
Control Type (TTL/-V) Driver (Current)
Package Type Chip

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