The MASW-009276-001DIE is a bumped GaAs pHEMT MMIC SP3T switch. Typical applications are WLAN (802.11 b/g) and Bluetooth applications.
The MASW-009276-001DIE delivers high isolation, low insertion loss, and high linearity at 2.4 - 2.5 GHz. This device is fabricated using a 0.5 micron gate length GaAs pHEMT process. The process features full passivation for performance and reliability. This die features SnAg(3.5%)Cu(1%) solder bumps for Wafer Level Chip Scale Package (WLCSP) applications.
