SpeedVal Kit Modular Evaluation Platform Power Daughter Cards – TO-263-7
Silicon Carbide MOSFETs in a TO-263-7 package support high power designs and simplify assembly with SMT processes. The SpeedVal Kit TO-263-7 power daughter cards feature two MOSFETs arranged in a half-bridge configuration. The unique card edge interface provides low inductance and simplifies the process of swapping out components, enabling high-quality measurements and quick comparisons between different devices. Power Daughter Cards are optimized for making accurate high-bandwidth current and voltage measurements.
An on-board current shunt can be optimized for highly accurate dynamic switching tests, or high-power thermal testing with the evaluation board. The coaxial MMCX connectors for VGS and IDS and BNC connectors for VDS provide noise-free measurements to improve accuracy and simplify gate drive optimization.
The power daughter cards include a pre-assembled heatsink which aligns with a fan on the motherboard to enable high-power testing.
Specifications
- Gate resistors onboard
- Heatsink preassembled on board
- BNC connector for lower VDS measurement
- MMCX connectors for VGS and IDS measurement
- Miller clamp transistor supported
- High-Bandwidth current sensor
What's Included
- Power Daughter Card
- Complete design files
MOD-PWR-MM-J1-J1 All Design Files
