MSCSM70XM75CTYZBNMG

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MSCSM70XM75CTYZ Microchip
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Product image for reference only. For precise specifications, refer to datasheet.

Manufacturer: Microchip
Mfg #: MSCSM70XM75CTYZBNMG
Richardson RFPD #: MSCSM70XM75CTYZ
Description: Silicon Carbide MOSFET Modules
Min/Mult: 2/1
Datasheet MSCSM70XM75CTYZ Data Sheet
EDA/CAD Models

Features
  • SiC Schottky Diode
  • SiC MOSFET
  • Low stray inductance
  • Lead frames for power connections
  • SI3N4 substrate for improved thermal performance
  • AlSiC base plate for extended reliability and reduced weight
  • Extended storage temperature range
  • Internal thermistor for temperature monitoring
Benefits
  • Stable temperature behavior
  • Very rugged
  • Solderable terminals for easy PCB mounting
  • Direct mounting to heatsink (isolated package)
  • Low junction-to-case thermal resistance
  • RoHS compliant
Applications
  • Hybrid Power Device (HPD) for Electro-Mechanical Actuator (EMA) and Electro-Hydrostatic Actuator (EHA) systems
  • High reliability Power Core Module (PCM)
  • Modular power module for Power Drive Electronic (PDE)

Key Attributes Value Search Similar
Voltage (V) 700
Current (A) 24
Configuration 3 Phase Bridge and Actuation Full-Options
Package Type HPD

Datasheets

  MSCSM70XM75CTYZ

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