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Product image for reference only. For precise specifications, refer to datasheet.
RF Power Transistor Clamping Device
The TO270WB and the TO270WBL are clamping devices intended to provide improved thermal and electrical performance for overmolded plastic packaged RF Power Transistors. Based on the recommendations in the NXP Semiconductor Application Note AN3789, the TO270WB and TO270WBL were designed to work in commercial grade RF applications. Please read NXP Semiconductor Application Note AN3789 for proper installation guidelines.
Freescale Clamping of High Power RF Transistors and RFICs
TO270WB TO270WBL Datasheet
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