X3C70F1-03S


Stock Availability: 3,917

Product image for reference only. For precise specifications, refer to datasheet.

Manufacturer: TTM Technologies
Mfg #: X3C70F1-03S
Richardson RFPD #: X3C70F1-03S-CT
Description: RF Hybrid Coupler
Min/Mult: 1
Datasheet X3C70F1-03S-CT Data Sheet
EDA/CAD Models

The X3C70F1-03S is a low profile, high performance 3dB hybrid coupler in a new easy to use, manufacturing friendly surface mount package. It is designed for LTE band applications. The X3C70F1-03S is designed particularly for high frequency radio link and other applications where low insertion loss and tight amplitude and phase balance is required. It can be used in high power applications up to 15 watts

Parts have been subjected to rigorous qualification testing and they are manufactured using materials with coefficients of thermal expansion (CTE) compatible with common substrates such as FR4, G-10, RF-35, RO4003 and polyimide. Produced with 6 of 6 RoHS compliant tin immersion finish.


Key Attributes Value Search Similar
Type Surface Mount
Minimum Frequency (GHz) 5.5
Maximum Frequency (GHz) 8.5
Power (W) 15
Dimensions (in/mm) 0.2 in L x 0.125 in W
Insertion Loss (dB) 0.25
Isolation (dB) 23
VSWR (-:1) 1.15
Phase (Degrees) 90

Datasheets

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Unit Price:
1:  $5.0900
10:  $4.5400
25:  $4.0700
50:  $3.7100
100:  $3.4000
250:  $3.1400
500:  $2.9200
1000:  $2.6700
2500:  $2.5700
4000:  $2.5700