Clamp Compression System

Clamp compression systems are a highly specialized type of thermal management solution for use with high power semiconductors, including compression pack semiconductor devices and RF power transistors. Clamp compression systems can be used with high-power compression pack semiconductor devices (e.g., disc-packaged devices; also referred to as “hockey puck” semiconductor devices), thyristors (SCRs) and rectifiers. Precision clamp compression systems are available for mounting, compression, and clamping of high-power disc-packaged devices to 5.25 in. (133.4) diameters, and 16,000 lbs. (7257.5 kg) of clamping force. Aluminum heat sinks and extrusion profiles complement the clamp systems, providing total thermal management solutions for a broad range of electronic and electrical system applications. These applications include power distribution equipment, industrial controls, transportation systems, industrial power supply, and industrial power conversion systems. Clamp compression systems for RF Power Transistors are manufactured to our specifications for use with specific plastic over-molded RF Power Transistor packages. Two of the clamping devices have been designed to be compatible with the industrial standard TO-270 package.